The book is all about
Nanotechnologies and Electronics Packaging. Packaging is the final manufacturing process transforming semiconductor devices into functional products. This provides electrical connections for signal transmission, power input, and voltage control, thermal dissipation and the physical protection required for reliability. Packaging governs the size, weight, and shape of the end product. Materials are at the heart of packaging technology. Packaging material contributes significantly to the packaged device performance, reliability and workability as well as to the total cost of the package. Nanomaterials and nanotechnologies promise to offer significant solutions towards packaging technology challenges in coming years. Carbon nanotubes (CNTs), nanowires and nanoparticles, have shown unique electrical, thermal, and mechanical properties orders of magnitude superior to current packaging materials used today.
Nanotechnologies and Electronics Packaging is the result of depth reviews written by some of the leading practitioners in the field. It covered the broad aspects of the field from materials preparations, materials properties, surface modifications, engineering applications, mathematical simulations. The editor of this book is a member of the IEEE Nanotechnology Council.
Chap. 1- introduced the scope of the field with a literature survey.
Chap. 2 - backed up with multiple examples of nanoscale modeling in packaging, present and future, including nanoimprinting, solder paste printing, microwave heating, underfill, and anisotropic conductive film.
Nanoparticle fabrication is introduced in
Chapter 3 -. 4 both focus on the molecular modeling technique, especially for interfacial characterization, with applications to carbon nanotube (CNT) thermal performance, moisture diffusion and thermal cycling, and delamination failures.
Chap. 5 - introductions to melting point depression, the coulomb block, interface diffusion effects, optical absorption, sintering, etc.
Chap. 6 - Nanoparticle fabrication is introduced.
Below are the table of contents:
1 Nanopackaging: Nanotechnologies and Electronics Packaging .......... 1
2 Modelling Technologies and Applications ............................................. 15
3 Application of Molecular Dynamics Simulation
in Electronic Packaging ........................................................................... 39
4 Advances in Delamination Modeling ..................................................... 61
5 Nanoparticle Properties .......................................................................... 93
6 Nanoparticle Fabrication ........................................................................ 109
7 Nanoparticle-Based High-k Dielectric Composites:
Opportunities and Challenges ................................................................ 121
8 Nanostructured Resistor Materials ........................................................ 139
9 Nanogranular Magnetic Core Inductors: Design, Fabrication,
and Packaging .......................................................................................... 163
10 Nanoconductive Adhesives .................................................................... 189
11 Nanoparticles in Microvias ................................................................... 209
12 Materials and Technology for Conductive Microstructures .............. 239
13 A Study of Nanoparticles in SnAg-Based Lead-Free Solders ............ 265
14 Nano-Underfills for Fine-Pitch Electronics ......................................... 287
15 Carbon Nanotubes: Synthesis and Characterization ......................... 325
16 Characteristics of Carbon Nanotubes
for Nanoelectronic Device Applications ............................................... 345
17 Carbon Nanotubes for Thermal Management of Microsystems ....... 377
18 Electromagnetic Shielding of Transceiver Packaging
Using Multiwall Carbon Nanotubes ..................................................... 395
19 Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders
Reinforced With Single-Wall Carbon Nanotubes ............................... 415
20 Nanowires in Electronics Packaging .................................................... 441
21 Design and Development of Stress-Engineered
Compliant Interconnect for Microelectronic Packaging ................... 465
22 Flip Chip Packaging for Nanoscale Silicon
Logic Devices: Challenges and Opportunities .................................... 491
23 Nanoelectronics Landscape: Application,
Technology, and Economy ..................................................................... 517
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