Motion Control in offshore and dredging - Engineering free ebooks

Motion Control in offshore and dredging

Motion Control in the Offshore and Dredging Industries  describes how drives of mechanisms that can be very large are designed and realized.This is between rotating and linear drives that make a distinction. For the choice of electrical drive, In the case of rotating drives, is becoming more and more prevalent. Linear drives remains important, because of the large forces and the highly dynamic behaviour, in the domain of fluid power drive technology. Both these important technologies are extensively discussed in this book with design rules and the many installation requirements that are useful for practical application.The book is meant for designers of new drive mechanisms. See contents below:

Chapter 1 Hydraulic energy converters 

1.1 List of symbols

1.2 Hydraulic pump types, constant output 

1.2.1 External gear pumps 

1.2.2 Internal gear pumps

1.2.3 Vane pumps 

1.2.4 Radial piston pumps 

1.3 Hydraulic pump types, variable output 

1.3.1 Swash plate pumps 

1.3.2 Proportional flow control 

1.3.3 Pressure control 

1.3.4 Load sense control 

1.4 Summary of pump characteristics 

1.5 Formulas

1.5.1 Volumetric efficiency / mechanical efficiency

1.6 Actuators: cylinders

1.6.1 Different types of cylinders

1.6.2 Formulas for a double action cylinder

1.6.3 Permissible speed 

1.6.4 Cylinder friction 

1.6.5 Application of the cylinder

1.6.6 Buckle calculation for cylinders 

1.6.7 Rod layers

1.6.8 Cylinder cushioning 

1.6.9 Cavitation

1.7 Actuators: hydraulic motors

1.7.1 Motor with fixed displacement or stroke volume

1.7.2 Motor with variable stroke volume

1.7.3 Formulas for a hydraulic motor

Chapter 2 Hydraulic energy control, conductive part

2.1 Pressure control valves

2.1.2 Pressure reducing valve

2.1.3 Pressure sequence valve

2.1.4 Brake (counter balance) valve

2.2 Directional valves

2.3 Flow valves

2.3.1 Non-return (check) valves

2.3.2 Throttle valves

2.4 Proportional and servo valves

2.4.1 General

2.4.2 Proportional controls 

2.4.3 Higher pressure drop across the valve ports

2.4.4 Performance curve for the proportional valve

2.4.5 The asymmetrical spool

2.4.6 Slowing down of a load

2.4.7 2-Way and 3-way pressure compensation, loadsensing 

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Fundamentals of Electric Circuits - Free electronics ebooks

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Fundamentals of Electric Circuits

This book is consist of 5 appendix in which users will find it very useful for studying this book. It has 18 chapters with access on the net and video for more visible in your learning. Fundamentals of electric circuits is designed to be effective supplement to any circuits text. Its primary focus is to enhance problem solving skills to aid students in developing more robust understanding of fundamentals. In this book, there ar 300 problems with solution and 99 of these are worked in detail. The main objectives of the author of this book, is to present circuit analysis in a manner that is clearer, more interesting and easier to understand than earlier texts. Each chapter opens with either a historical profile of some electrical engineering pioneers to be mentioned in the chapter or a carrier discussion on a subdiscipline of electrical engineering.An introduction links the chapter with the previous chapters and state the chapter's objectives. The chapter ends with a summary of the key points and formulas. All principles are presented in a lucid, logical, step-by-step manner. Important formulas are boxed as means of helping students. Marginal notes are used asa pedagogical aid. Thorough worked examples are liberally given at the end of every section. 

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Coupled Data Communication Techniques for High Performance and Low-Power Computing

Coupled Data Communication Techniques for High Performance and Low-Power Computing

This book describes that proximity connections are fast and it occupies small area and consume little energy. Proximity communication permits one to replace chips in a big system. Together, quality and replacement make wafer-scale integration possible.  A complete system could serve as a jig that would test fresh chips in their real environment.Huge potential for replacement to simplify and improve test may permit a profound change in the business alliances that produce products, according to the author. Without the ability to replace, one bad chip destroys an entire multi-chip module, making specialization in module assembly a poor business.

Part I Introduction

1 Introduction to Coupled Data Technologies (Ron Ho, Robert Drost)

1.1 Life has been good 

1.2 Faster computers tomorrow 

1.2.1 The end of Moore’s Law 

1.2.2 The arguments against–and for–multiple chips 

1.3 Coupled data communication

1.3.1 This book 

Part II Overview of 3D Technologies

2 Power delivery, signaling and cooling for 2D and 3D integrated

systems (Muhannad Bakir, Gang Huang and Bing Dang)

2.1 Introduction

2.2 Evolution of conventional silicon ancillary technologies: A brief overview 

2.3 Novel silicon ancillary technologies

2.3.1 Optical I/Os

2.3.2 Fluidic I/Os for single and 3D chips

2.4 Power delivery for 2D and 3D systems 

2.4.1 Power delivery and design implications of 2D systems

2.4.2 Power delivery and design implications of 3D systems

3 Capacitive Coupled Communication

(David Hopkins, Alex Chow, Frankie Liu, Dinesh D. Patil, Hans Eberle)

3.1 Introduction 

3.2 An electrical model of capacitive interchip communication 

3.2.1 Crosstalk mitigation

3.2.2 Simulation results

3.3 Transmitting data

3.4 Receiving data

3.4.1 Attenuation 

3.4.2 Loss of DC information 

3.4.3 Comparators

3.4.4 Receiver sizing 

3.4.5 Timing schemes

3.5 Two-dimensional arrays

3.6 Measurement results

3.6.1 Voltage waterfall

3.6.2 Timing waterfall 

3.6.3 Combined eye diagram 

3.6.4 BER versus chip separation

3.7 Prototype application: a high-radix switch

4 Inductive Coupled Communications 

(Noriyuki Miura, Takayasu Sakurai, and Tadahiro Kuroda)

4.1 Introduction 

4.2 Inductive-coupling channel 

4.2.1 Overview of channel characteristics

4.2.2 Range extendability

4.2.3 Coupling strength through Si substrate

4.2.4 Crosstalk

4.3 Inductive-coupling transceiver

4.3.1 Signaling

4.3.2 Coil design 

4.3.3 Transceiver circuit design 

4.3.4 Inter-chip communications

4.4 Power reduction techniques

4.4.1 Pulse shaping

4.4.2 Daisy chain transmitter

4.5 High-speed techniques

4.5.1 Asynchronous transceiver

4.5.2 Burst transmission 

4.6 Crosstalk reduction techniques 

4.6.1 Time interleaving

4.7.1 Homogenous chip stacking

4.7.2 Inductive-coupling up/down repeater

4.7.3 Test chip measurement 

4.8 Application II: processor and memory stacking 

4.8.1 Heterogenous chip stacking 

4.8.2 Interface design 

4.8.3 Test chip measurement

4.9 Conclusion

5 Use of AC Coupled Interconnect in Contactless Packaging

(Paul Franzon)

5.1 Introduction: Why use ACCI?

5.1.1 Chapter outline 

5.2 Historical Perspectives

5.3 Capacitively Coupled Chip I/O 

5.3.1 Capacitively Coupled Channel Design

5.3.2 ACCI Circuits

5.3.3 ACCI Packaging 

5.4 Mid-channel Capacitively Coupled Structures

5.5 Inductively Coupled Connectors and Sockets 

5.6 Conclusions and Future Perspectives

Part IV Enabling Coupled Data Technologies

6 Aligning chips face-to-face for dense capacitive communication

(John E. Cunningham, Ashok V. Krishnamoorthy, Ivan Shubin, James

G. Mitchell, Xuezhe Zheng)

6.1 Introduction

6.2 Aligning chips face-to-face

6.2.1 Power and ground connections between coupled chips

6.3 A low-cost package for capacitive proximity communication 

6.4 Array packages using bridge chips

Part V Extending Data Coupling Technologies

7 Delivering On-chip Bandwidth Off-chip and Out-of-box with

Proximity and Optical Communication 

Ashok V. Krishnamoorthy, Jon Lexau, Xuezhe Zheng, John E.

Cunningham

7.1 Introduction

7.2 Photonics as a long-reach interconnect

4.6.2 Differential coil

4.7 Application I: memory stacking

7.5 Test chip results

7.6 Conclusion 

8 AC Coupled Wireless Power Delivery

(Makoto Takamiya, Kohei Onizuka, and Takayasu Sakurai)

8.1 Three dimensional stacked inter-chip wireless power delivery

8.2 Prototype of wireless power transmission circuits

8.3 Theoretical analysis and circuit improvements

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